无线集成电路与系统实验室（WiCAS）

Wireless Integrated Circuit and System Lab

MS/PhD/Postdoc positions open！

现招收品学兼优、勇于创新的硕士生、博士生以及博士后。

欢迎有志于从事人工智能算法、射频／模拟／数字IC、天线、智能系统研究的同学加入。

实验室为学生提供与工业界接轨的设计理念，开放包容的科研环境和帮助优秀学生提供工业界实习机会。

WiCAS课题组研究方向:

人工智能增强无线集成电路、算法与系统 AI for Wireless （AI4W）

先进CMOS工艺上的高性能收发机架构与芯片设计

应用于智能传感器和5G/6G通讯的毫米波集成电路与系统

面向智能物联网等新型应用的无线SoC芯片与算法一体化微系统

教育背景：

美国加州大学圣芭芭拉分校，电子与计算机工程，博士

美国加州大学圣芭芭拉分校，经济学，硕士

复旦大学，电子工程，学士

工作经历：

2015年-至今 复旦大学微电子学院，研究员，博士生导师

2005年-2015年 英特尔公司 (Intel Corp) ，英特尔研究院（Intel Labs）主管研究科学家

主要成果及荣誉：

IEEE 高级会员

累计发表150+篇期刊会议论文：

无线集成电路：12 ISSCC; 17 JSSC; 2 TCASI; 3 RFIC; 2 CICC; 4 VLSI-C; 4 ESSERC

微波电路与系统：4 TMTT; 10 MWCL; 4 IMS; 2 CSICS

器件与工艺：2 EDL; 1 VLSI-T; 1 DRC

天线/算法：1 TAP, 1 TRS, 1 DAC

13项美国专利

2篇英文著作

近期国际学术重要职务：

IEEE JSSC 副主编 2024至今

IEEE MWTL 副主编 2019-2024

IEEE 国际固态电路会议 ISSCC 技术评审委员 2020-2025

IEEE 国际射频集成电路会议 RFIC 指导委员/技术评审委员2015-2024

IEEE 国际电子器件会议 IEDM 技术评审委员 2021-2022

IEEE 国际无线会议 IWS 技术评审委员 2013-2020

IEEE JSSC 客座编辑 Guest Editor 2019-2020

行业研发经历：

1. 高集成度智能毫米波传感器SoC

集成毫米波收发机、超宽带调频锁相环、高精度ADC、信号处理加速器、电源管理等关键功能的单芯片智能毫米波传感器SoC。广泛应用于自动驾驶、无人机、机器人、智能家居等多样化智能物联网领域。

2.超低功耗SoC系统开发项目

业界首枚14纳米CMOS无线低功耗WiFi SoC芯片，应用于搭建无线传感网、物联网和可穿戴设备。

3.先进CMOS工艺下高性能无线收发机的设计

超过20年包括收发机前端的无线射频元件，无线系统开发及射频电路数字化创新。经历从90纳米到14纳米的无线系统开发，开发出用于低功耗和低成本无线系统的颠覆性的无线收发机的架构，并应用于英特尔无线通讯产品中。

4.高性能CMOS数字射频功率放大器（PA）

领导并研发了多款高性能CMOS功率放大器。其中首创的outphasing和dynamic power control数字式功率放大器，成果证明了用数字方法实现射频的射频功率放大器，性能可以超越传统的设计方式，成为行业性能标杆。

5.全集成基于高性能GaN HEMT的微波电路（MMIC）

净化间微波GaN HEMT器件工艺开发，完成从微波器件制造，工艺集成到电路建模和设计流程，设计开发包括PA，VCO和LNA在内的高性能微波电路。首创了可集成在化合物半导体上的可调制铁电材料器件制造工艺，极大减小微波元件的尺寸，并设计高性能自适应的微波电路。

论文选摘：

[1] X. Ma, W. Li, S. Dong, R. Lyu, F. Chen, Y. Pu, C. Wang and Hongtao Xu, “A Compact Full-Duplex Receiver with Wideband Multi-Domain Hilbert-Transform-Equalization Cancellation Based on Multi-Stage APFs Achieving 65dB SIC Across 120MHz BW”, 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, February 16-20

[2] C. Hu, J. Li, J. Lin, Hongtao Xu and Y. Yin, “A Wideband Replicas-Rejection Digital Transmitter Using Joint-Digital-Analog Interpolation and Filtering in 28nm CMOS”, 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, February 16-20

[3] W. Zuo, Y. Wang, S. Han, Y. Li, W. Li, Y. Lin and Hongtao Xu, A 2.4-GHz-BW 59.7-dB-Range 0.39-dB-Error dB-Linear VGA Featuring –40 ∘C~110 ∘C and ±10%-Supply PVT Robustness in 40-Nm CMOS, IEEE Journal of Solid-State Circuits (JSSC), 2025, Early Access

[4] S. Han, Y. Wang, Y. Li, W. Zuo, W. Li, Y. Yin, Y. Lin and Hongtao Xu,  A 1–21-GHz, 1.95–3.1-dB NF Ultra-Wideband LNA With Gm-Assisted-Feedback Noise Suppression Achieving 140-Gb/s Data Rate in 40-nm CMOS, IEEE Journal of Solid-State Circuits (JSSC), 2025, Early Access

[5] J. Li, Z. Li, Y. Yin, C. Yan, N. Qi, M. Liu and Hongtao Xu, A Six-Phase Harmonic-Rejection Digital Transmitter, IEEE Journal of Solid-State Circuits (JSSC), 2025, Early Access

[6] B. Yu, K. Xu, W. Li and Hongtao Xu, “A 31.92% Efficiency Colpitts DCO-PA for BLE TX with Implicit RX Clock Generation Using DM-to-CM Mode-switching”, 2024 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2024, November 18-21

[7] F. Gao, L. Guo, Y. Li, Y. Yin and Hongtao Xu, “Nonlinear Analysis of Quadrature Switched-Capacitor Power Amplifier and Digital Predistortion”, IEEE Transactions on Circuits and Systems I: Regular Papers(TCAS-I), 2024, 71(12), 6255 - 6264

[8] B. Jiang, P. Li, S. Zheng, Y. Lin and Hongtao Xu, “A 24-GHz Beam-Steerable Multinode Wireless Power Transfer System With a Maximum DC Output of 5.7 dBm at 1-m Distance”, IEEE Transactions on Microwave Theory and Techniques (TMTT), 2024, 72(11), 6774 - 6789

[9] R. Liu, X. Song, J. Qian, S. Hao, Yue Lin and Hongtao Xu, “A Data-Driven Method for Indoor Radar Ghost Recognition With Environmental Mapping”, IEEE Transactions on Radar Systems (TRS), 2024, 2(9), 910-923

[10] W. Zuo, Y. Wang, S. Han, Y. Li, W. Li, Y. Lin and Hongtao Xu, “A PVT-Robust 2.4-GHz-BW 59.7-dB-Range 0.39-dB-Error dB-Linear VGA with Self-Compensated Exponential Generator and Self-Adaptive Bias”, 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, September 9-12

[11] Y. Li, Y. Wang, S. Han, Z. Deng, W. Zuo, W. Li, Y. Lin and Hongtao Xu, “A 1.5-to-23.5 GHz High-Power-Density Distributed PA Achieving 150.5 Gb/s Data Rate With 14.4 dBm Pavg Supporting 64/128/256-QAM in 40-nm CMOS”, 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, September 9-12

[12] W. Zeng, L. Gao, N-Z. Sun, H-Y. Li, J-X. Xu, Hongtao Xu, Q. Xue and X. Zhang, A Compact 19.7- to 43.8-GHz Power Amplifier With 20.3-dBm Psat and 35.5% PAE in 28-nm Bulk CMOS, IEEE Journal of Solid-State Circuits (JSSC), 2024, 59(8), 2455-2468

[13] Y. Li, Y. Yin, D. Zheng, F. Gao, J. Lin, Z. Hu, Y. Lu and Hongtao Xu, A Quadrature Digital Power Amplifier With Wide Efficiency Enhancement Coverage and High Dynamic Power Range, IEEE Journal of Solid-State Circuits (JSSC), 2024, 59(7), 2133-2144

[14] S. Han, Y. Wang, Y. Li, W. Zuo, W. Li, Y. Lin and Hongtao Xu, A 140-Gbps 1-to-21-GHz Ultra-Wideband LNA Achieving 1.95-to-3-dB NF Using Gm-Assisted-Feedback Noise Suppression Technique in 40nm Bulk CMOS, 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI-C), 2024, Jun 16-20

[15] W. Zeng, L. Gao, H-Y. Li, J-X. Xu, Hongtao Xu and X. Y. Zhang , “A Tri-Mode Filtering Power Amplifier for 5G Millimeter-Wave Dual-Side LO Injection Systems with Power-Efficiency Enhancement”, IEEE Custom Integrated Circuits Conference (CICC), 2024, April 21-24

[16] J. Li, Z. Li, Y. Yin, C. Yan, N. Qi, M. Liu and Hongtao Xu, “4.4 A Highly-Integrated 6-Phase Cell-Reused Digital Transmitter Using 1/3 Duty-Cycle LO Signals for Harmonic Rejection”, 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, February 18-22

[17] J. Li, Y. Yin, H. Chen, J. Lin, Y. Li, X. Jia, Z. Hu, Z. Liu, X. Zhang and Hongtao Xu, “A Transformer-Based Quadrature Doherty Digital Power Amplifier With 4.1 W Peak Power in 28 nm Bulk CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 58(12), 3296-3307

[18] C. Wang, X. Ma, W. Li, F. Chen, W. Zuo, Y. Pu, J. Zhou and Hongtao Xu, “A Wideband Full-Duplex Receiver With Multi-Domain Self-Interference Cancellation Based on Capacitor Stacking Delay and Delay Compensation in Cancellers”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 59(6), 1697-1708

[19] K. Xu, B. Yu, J. Hu, Y. Li, R. B. Staszewski, and Hongtao Xu, “A 50μW Ring-Type Complementary Inverse-Class-D Oscillator with 191.4dBc/Hz FoM and 205.6dBc/Hz FoMA”, 2023 Symposium on VLSI Circuits (VLSI-C), 2023, June 11-16

[20] C. Hu, D. Zheng, Y. Yin, J. Lin, Y. Li, W. Li and Hongtao Xu, “A Wideband Sliding Digital-IF Quadrature Digital Transmitter for Multimode NB-IoT/BLE Applications”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 59(5), 1509 - 1520

[21] C. Fang, Y. Wang, C. Yang, T. Li, Y. Chen, Y. Lin and Hongtao Xu, “A 22.5–33.5-GHz Hybrid Phase Shifter With Low Phase and Amplitude Error for 5G and Satellite Communication”, IEEE Transactions on Microwave Theory and Techniques (TMTT), 2023, 72(5), 3001-3015

[22] C. Hu, D. Zheng, Y. Yin, J. Lin, Y. Li, W. Li, and Hongtao Xu, “A 0.7-to-2.5GHz Sliding Digital-IF Quadrature Digital Transmitter Achieving >40% System Efficiency for Multi-Mode NB-IoT/BLE Applications,” IEEE International Solid-State Circuits Conference (ISSCC), 2023, 472-473

[23] J. Li, Y. Yin, H. Chen, J. Lin, Y. Li, X. Jia, Z. Hu, X. Zhang, and Hongtao Xu, “A 4.1W Quadrature Doherty Digital Power Amplifier with 33.6% Peak PAE in 28nm Bulk CMOS,” IEEE International Solid-State Circuits Conference (ISSCC), 2023, 370-371

[24] W. Zeng, L. Gao, N. Sun, Hongtao Xu, Q. Xue, X. Zhang, “A 19.7-to-43.8GHz Power Amplifier with Broadband Linearization Technique in 28nm Bulk CMOS,” IEEE International Solid-State Circuits Conference (ISSCC), 2023 372-373

[25] C. Wang, W. Li, F. Chen, W. Zuo, Y. Pu, and Hongtao Xu, “A 0.5–4GHz Full-Duplex Receiver with Multi-Domain Self-Interference Cancellation Using Capacitor Stacking Based Second-Order Delay Cells in RF Canceller”, 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2022, June 19-21

[26] C. Hu, Y. Yin, T. Li, Y. Liu, L. Xiong, and Hongtao Xu, “A Fully-Integrated Wideband Digital Polar Transmitter with 11-bit Digital-to-Phase Converter in 40nm CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 58(2), 462-473

[27] C-C. Yang , T. Li, C. Xu, Y. Chen, Y. Lin , Y. Yin, and Hongtao Xu, A Low-Phase Error Cascode CMOS Variable Gain Amplifier With 180◦ Phase Control for Phase Array Systems, IEEE Transactions on Microwave Theory and Techniques (TMTT), 2022

[28] T-Q Fan, B. Jiang, R. Liu, J. Xiu, Y. Lin, and H. Xu, “A Novel Double U-slot Microstrip Patch Antenna Design for Low-Profile and Broad Bandwidth Applications”, IEEE Transactions on Antennas and Propagation (TAP), 2022

[29] Y. Li, Y. Yin, D. Zheng, X. Jia, J. Lin, F. Gao, Y. Zhu, L. Xiong, N. Yan, Y. Lu, and Hongtao Xu, “A 15-bit Quadrature Digital Power Amplifier with Transformer-Based Complex Domain Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2021

[30] Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, and Hongtao Xu, “A Broadband Switched-Transformer Digital Power Amplifier for Deep Back-Off Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2020

[31] D. Zheng, Y. Yin, Y. Zhu, L. Xiong, Y. Li, N. Yan, and Hongtao Xu, “A 15b Quadrature Digital Power Amplifier with Transformer-Based Complex-Domain Power-Efficiency Enhancement”, 2020 IEEE International Solid-State Circuits Conference (ISSCC), 2020

[32] T. Li, L Xiong, Y. Yin, Y. Liu, H. Min, N. Yan, and Hongtao Xu, “A Wideband Digital Polar Transmitter with Integrated Capacitor-DAC-Based Constant-Envelope Digital-to-Phase Converter”, 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2019

[33] Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, and Hongtao Xu, “A Compact Dual-Band Digital Polar Doherty Power Amplifier Using Parallel-Combining Transformer”, IEEE Journal of Solid-State Circuits (JSSC), 2019

[34] W. Luo, Y. Yin, L. Xiong, T. Li, and Hongtao Xu, “Nonlinear Analytical Model for Switched-Capacitor Class-D RF Power Amplifiers”, IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), 2019

[35] Y. Yin, Y. Zhu, L. Xiong, W. Luo, B. Chen, T. Li, N. Yan, and Hongtao Xu, “A Compact Transformer-Combined Polar/Quadrature Reconfigurable Digital Power Amplifier in 28nm Logic LP CMOS”, IEEE Journal of Solid-State Circuits (JSSC invited), 2019

[36] L. Xiong, T. Li, Y. Yin, H. Min, N. Yan, and Hongtao Xu, “A Broadband Switched-Transformer Digital Power Amplifier for Deep Back-Off Efficiency Enhancement”, 2019 IEEE International Solid-State Circuits Conference (ISSCC), 2019

[37] Y. Zhu, L. Xiong, Y. Yin, W. Luo, B. Chen, T. Li, Hongtao Xu, “A Compact 2.4GHz Polar/Quadrature Reconfigurable Digital Power Amplifier in 28nm Logic LP CMOS”, 2018 IEEE Custom Integrated Circuits Conference (CICC), 2018 (Best Student Paper final list).

[38] Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, Hongtao Xu, “A Compact Dual-Band Digital Doherty Power Amplifier Using Parallel- Combining Transformer for Cellular NB-IoT Applications”, 2018 IEEE International Solid-State Circuits Conference (ISSCC), 2018

[39] P. Madoglio, Hongtao Xu, K. Chandrashekar et al., “A 2.4GHz WLAN Digital Polar Transmitter with Synthesized Digital-to-Time Converter in 14nm Trigate/FinFET Technology for IoT and Wearable Applications”, 2017 IEEE International Solid-State Circuits Conference (ISSCC), 2017

[40] A. Ravi, P. Madoglio, Hongtao Xu et al., “A 2.4-GHz 20–40-MHz Channel WLAN Digital Outphasing Transmitter Utilizing a Delay-Based Wideband Phase Modulator in 32-nm CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2012

[41] W. Tai, Hongtao Xu, Ravi, A. et al., “A Transformer-Combined 31.5 dBm Outphasing Power Amplifier in 45 nm LP CMOS With Dynamic Power Control for Back-Off Power Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2012

[42] P. Madoglio, A. Ravi, Hongtao Xu et al., “A 20dBm 2.4GHz digital outphasing transmitter for WLAN application in 32nm CMOS”, 2012 IEEE International Solid-State Circuits Conference (ISSCC), 2012

[43] W. Tai, Hongtao Xu, A. Ravi et al., “A 31.5dBm Outphasing Class-D Power Amplifier in 45nm CMOS with Back-Off Efficiency Enhancement by Dynamic Power Control”. 2011 European Solid-State Circuits Conference (ESSCIRC), 2011

[44] Hongtao Xu, Y. Palaskas, A. Ravi et al., “A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application”, IEEE Journal of Solid-State Circuits (JSSC invited), 46(7), 2011

[45] Y. Tan, Hongtao Xu, M.A. El-tanani et al., “A flip-chip-packaged 1.8V 28dBm class-AB power amplifier with shielded concentric transformers in 32nm SoC CMOS”, 2011 IEEE International Solid-State Circuits Conference (ISSCC), 2011

[46] Hongtao Xu, Y. Palaskas, A. Ravi et al., A highly linear 25dBm outphasing power amplifier in 32nm CMOS for WLAN application”, 2010 European Solid-State Circuits Conference (ESSCIRC), 2010

[47] Hongtao Xu, Y. Palaskas, A. Ravi et al., A 28.1dBm class-D outphasing power amplifier in 45nm LP digital CMOS, 2009 Symposium on VLSI Circuits (VLSI-C), 2009